Conference proceeding
Finite element modeling and analysis of composite coverboards
2011 International Conference on Electric Technology and Civil Engineering (ICETCE), pp.363-366
04/2011
Handle:
https://hdl.handle.net/2376/112579
Abstract
A finite element (FE) modeling of coverboard is conducted, and the deflection and stresses of the coverboard for intended application are discussed. Based on the FE analysis, a feasible thickness value of the coverboard which satisfies the deflection requirement is recommended for potential manufacturing.
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Details
- Title
- Finite element modeling and analysis of composite coverboards
- Creators
- Luyang Luyang Shan - Dept. of Civil Eng., Zhejiang Univ. of Technol., Hangzhou, ChinaPizhong Pizhong Qiao - Dept. of Civil & Environ. Eng., Washington State Univ., Pullman, WA, USA
- Publication Details
- 2011 International Conference on Electric Technology and Civil Engineering (ICETCE), pp.363-366
- Publisher
- IEEE
- Identifiers
- 99900547541701842
- Language
- English
- Resource Type
- Conference proceeding