- Title
- High strain behavior of composite thin film piezoelectric membranes
- Creators
- I DEMIR - School of Mechanical and Materials Engineering, Washington State University, P.O. Box 642920, Pullman, WA 99164-2920, United StatesA. L OLSON - School of Mechanical and Materials Engineering, Washington State University, P.O. Box 642920, Pullman, WA 99164-2920, United StatesJ. L SKINNER - School of Mechanical and Materials Engineering, Washington State University, P.O. Box 642920, Pullman, WA 99164-2920, United StatesC. D RICHARDS - School of Mechanical and Materials Engineering, Washington State University, P.O. Box 642920, Pullman, WA 99164-2920, United StatesR. F RICHARDS - School of Mechanical and Materials Engineering, Washington State University, P.O. Box 642920, Pullman, WA 99164-2920, United StatesD. F BAHR - School of Mechanical and Materials Engineering, Washington State University, P.O. Box 642920, Pullman, WA 99164-2920, United States
- Publication Details
- Microelectronic engineering, Vol.75(1), pp.12-23
- Conference
- Proceedings of the Symposium on Characterization and Mechanical Reliability of Advanced Electronic Materials at Nanoscale
- Academic Unit
- Mechanical and Materials Engineering, School of
- Publisher
- Elsevier Science; Amsterdam
- Grant note
- ASME ; Materials Division ; Committee on Electronic Materials
- Identifiers
- 99900546846501842
- Language
- English
- Resource Type
- Conference proceeding
Conference proceeding
High strain behavior of composite thin film piezoelectric membranes
Microelectronic engineering, Vol.75(1), pp.12-23
Proceedings of the Symposium on Characterization and Mechanical Reliability of Advanced Electronic Materials at Nanoscale
2004
Handle:
https://hdl.handle.net/2376/106607
Abstract
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