Thesis
Design optimization of headband for headphone
Washington State University
Master of Science (MS), Washington State University
2009
Handle:
https://hdl.handle.net/2376/100102
Abstract
There is an ever increasing demand for improvement of performance, reliability and cost effectiveness of headphones. A product designer is required to integrate the perspectives from marketing, consumers and manufacturing by using efficient analysis tools which can be applied into a systematic approach to the problem. The potential failure mode and effect analysis (FMEA) of headband design allows a designer to construct a qualitative analysis of a system for the purpose of identifying critical characteristics. It further allows the designer to examine the causes and effects associated with each potential failure mode's occurrence. Two high risk failure modes are improper clamping force and headband fatigue failure. Both failure modes are dominated by two design factors, metal band thickness and tensile strength. Finite Element Analysis (FEA) was used to estimate the design responses, which are headband fatigue life and clamping force. These responses coupled with the optimization module presented a solution which will help determine optimal metal band thickness and tensile strength, while maintaining the targets of performance; cost and reliability of the headband.
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Details
- Title
- Design optimization of headband for headphone
- Creators
- Jason Lin
- Contributors
- Dave Kim (Degree Supervisor)
- Awarding Institution
- Washington State University
- Academic Unit
- Electrical Engineering and Computer Science, School of
- Theses and Dissertations
- Master of Science (MS), Washington State University
- Publisher
- Washington State University; Pullman, Wash. :
- Identifiers
- 99900525190201842
- Language
- English
- Resource Type
- Thesis