Thesis
Evolution of annealing twins in sputtered Cu thin films
Washington State University
Master of Science (MS), Washington State University
2009
Handle:
https://hdl.handle.net/2376/102905
Abstract
The Monte Carlo Potts model with N-fold method has been used to simulate grain structure evolution in thin Cu films according to energetic competition principles. The energetic considerations of surface/interface, grain boundary and strain energy factors were applied to determine grain growth and crystallographic texture evolution as a function of film thickness such as 100 nm, 500 nm and 800 nm. Furthermore, annealing twins in FCC metals with low stacking fault energy are typically related to the parent by 60° rotation about the crystal direction. These twins can change the crystallographic texture and grain boundary character distribution in films and line structures. These factors can be simulated through specific criteria that arbitrarily insert twin grains into the structure through grain boundary energy considerations. Four different types of microstructures have been observed experimentally and these have been simulated by the Monte Carlo technique. The focus is on the texture and grain structure evolution and how these can be modeled using the Monte Carlo Potts model. Using the overall energy minimization concept to model microstructure evolution in Cu thin films, the capabilities and difficulties of using Monte Carlo Potts Model are demonstrated
Metrics
4 File views/ downloads
37 Record Views
Details
- Title
- Evolution of annealing twins in sputtered Cu thin films
- Creators
- Chang-Kyu Yoon
- Contributors
- David P Field (Degree Supervisor)
- Awarding Institution
- Washington State University
- Academic Unit
- Mechanical and Materials Engineering, School of
- Theses and Dissertations
- Master of Science (MS), Washington State University
- Publisher
- Washington State University; Pullman, Wash. :
- Identifiers
- 99900525184401842
- Language
- English
- Resource Type
- Thesis