Thesis
In situ EBSD observation of grain boundary migration during annealing of copper
Washington State University
Master of Science (MS), Washington State University
2014
Handle:
https://hdl.handle.net/2376/100377
Abstract
The main objective of this study is to observe grain boundary migration during annealing and analyze the misorientation distribution function of moving boundaries in order to determine which boundaries preferentially migrate during annealing. Successive scans were performed on samples during annealing at temperatures of 150 and 340 with an in situ heating stage for cold rolled and grain boundary engineered (GBE) copper specimens, respectively. The microstructural evolution during annealing was characterized in situ by automated Electron Backscatter Diffraction (EBSD) or orientation Imaging Microscopy (OIM). Microstructural evolution such as recrystallization and grain growth v were observed from cold rolled copper. It is concluded that the S9 grain boundaries in GBE Cu have a slight tendency for migrating.
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Details
- Title
- In situ EBSD observation of grain boundary migration during annealing of copper
- Creators
- Linxiao Zhao
- Contributors
- David P. Field (Degree Supervisor)
- Awarding Institution
- Washington State University
- Academic Unit
- Mechanical and Materials Engineering, School of
- Theses and Dissertations
- Master of Science (MS), Washington State University
- Publisher
- Washington State University; [Pullman, Washington] :
- Identifiers
- 99900525290501842
- Language
- English
- Resource Type
- Thesis