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Thermal and flow impact of cylindrical grooves in channel flow
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Thermal and flow impact of cylindrical grooves in channel flow

Thomas E. Conder
Washington State University
Master of Science (MS), Washington State University
2009
Handle:
https://hdl.handle.net/2376/101837
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Abstract

Electronic apparatus and appliances--Thermal properties.;Microprocessors.;Heat--Transmission.;Cooling.

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