- Title
- A comparison of impression and compression creep behavior of polycrystalline Sn
- Creators
- C PARK - Department of Mechanical & Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA 93940, United StatesX LONG - Department of Mechanical & Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA 93940, United StatesS HABERMAN - Department of Mechanical & Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA 93940, United StatesS MA - Department of Mechanical & Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA 93940, United StatesI DUTTA - Department of Mechanical & Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA 93940, United StatesR MAHAJAN - Intel Corporation, Assembly Technology Development, 5000 West Chandler Boulevard, Chandler, AZ 85226, United StatesS. G JADHAV - Intel Corporation, Assembly Technology Development, 5000 West Chandler Boulevard, Chandler, AZ 85226, United States
- Publication Details
- Journal of materials science, Vol.42(13), pp.5182-5187
- Academic Unit
- Mechanical and Materials Engineering, School of
- Publisher
- Springer; Heidelberg
- Identifiers
- 99900547860201842
- Language
- English
- Resource Type
- Journal article
Journal article
A comparison of impression and compression creep behavior of polycrystalline Sn
Journal of materials science, Vol.42(13), pp.5182-5187
2007
Handle:
https://hdl.handle.net/2376/115963
Abstract
Metrics
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