Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates : Effect of Microstructure and Test Conditions

Journal article

Peer reviewed

XIN XIN LONG, Indranath DUTTA, Vijay SARIHAN and Darrel R FREAR

Journal of electronic materials, Vol.37(2), pp.189-200

2008

Handle:

https://hdl.handle.net/2376/110807

Abstract

Brazing. Soldering

Mechanical and acoustical properties of condensed matter

Elasticity, elastic constants

Exact sciences and technology

Condensed matter: structure, mechanical and thermal properties

Microelectronic fabrication (materials and surfaces technology)

Electronics

Materials science

Physics

Treatment of materials and its effects on microstructure and properties

Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices

Metals. Metallurgy

Mechanical properties of solids

Applied sciences

Deformation, plasticity, and creep

Cross-disciplinary physics: materials science; rheology

Joining, thermal cutting: metallurgical aspects

6 Record Views

Title: Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates : Effect of Microstructure and Test Conditions
Creators: XIN XIN LONG - Center for Materials Science and Engineering, Department of Mechanical & Astronautical Engineering, Naval Postgraduate School, Monterey, CA 93943, United States
Indranath DUTTA - Center for Materials Science and Engineering, Department of Mechanical & Astronautical Engineering, Naval Postgraduate School, Monterey, CA 93943, United States
Vijay SARIHAN - Freescale Semiconductor, Inc., 2100 E. Elliott Road, Tempe, AZ 85284, United States
Darrel R FREAR - Freescale Semiconductor, Inc., 2100 E. Elliott Road, Tempe, AZ 85284, United States
Publication Details: Journal of electronic materials, Vol.37(2), pp.189-200
Academic Unit: Mechanical and Materials Engineering, School of
Publisher: Institute of Electrical and Electronics Engineers; New York, NY
Identifiers: 99900548571601842
Language: English
Resource Type: Journal article