Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders

Journal article

Peer reviewed

T CHEN and I DUTTA

Journal of electronic materials, Vol.37(3), pp.347-354

2008

Handle:

https://hdl.handle.net/2376/114984

Abstract

Brazing. Soldering

Metals. Metallurgy

Exact sciences and technology

Materials

Electronics

Materials science

Applied sciences

Deformation, plasticity, and creep

Physics

Cross-disciplinary physics: materials science; rheology

Treatment of materials and its effects on microstructure and properties

Joining, thermal cutting: metallurgical aspects

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Title: Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders
Creators: T CHEN - Department of Mechanical and Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA 93943, United States
I DUTTA - Department of Mechanical and Astronautical Engineering, Center for Materials Science and Engineering, Naval Postgraduate School, Monterey, CA 93943, United States
Publication Details: Journal of electronic materials, Vol.37(3), pp.347-354
Academic Unit: Mechanical and Materials Engineering, School of
Publisher: Institute of Electrical and Electronics Engineers; New York, NY
Identifiers: 99900548210601842
Language: English
Resource Type: Journal article