Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate

Journal article

Peer reviewed

S Das Mahapatra, B. S Majumdar, I Dutta and S Bhassyvasantha

Journal of electronic materials, Vol.46(7), pp.4062-4075

07/2017

Handle:

https://hdl.handle.net/2376/114881

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Title: Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate
Creators: S Das Mahapatra
B. S Majumdar
I Dutta
S Bhassyvasantha
Publication Details: Journal of electronic materials, Vol.46(7), pp.4062-4075
Academic Unit: Mechanical and Materials Engineering, School of
Identifiers: 99900548327901842
Language: English
Resource Type: Journal article