Fungal degradation of wood-plastic composites and evaluation using dynamic mechanical analysis

Journal article

Peer reviewed

Anke SCHIRP and Michael P WOLCOTT

Journal of applied polymer science, Vol.99(6), pp.3138-3146

2006

Handle:

https://hdl.handle.net/2376/113315

Abstract

Applied sciences

Technology of polymers

Composites

Exact sciences and technology

Polymer industry, paints, wood

Forms of application and semi-finished materials

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Title: Fungal degradation of wood-plastic composites and evaluation using dynamic mechanical analysis
Creators: Anke SCHIRP - Wood Materials and Engineering Laboratory, Department of Civil and Environmental Engineering, Washington State University, P.O. Box 641806, Pullman, Washington 99164-1806, United States
Michael P WOLCOTT - Wood Materials and Engineering Laboratory, Department of Civil and Environmental Engineering, Washington State University, P.O. Box 641806, Pullman, Washington 99164-1806, United States
Publication Details: Journal of applied polymer science, Vol.99(6), pp.3138-3146
Academic Unit: Office of Clean Technology
Publisher: Wiley; New York, NY
Identifiers: 99900547955701842
Language: English
Resource Type: Journal article