Journal article
High-Q LTCC-based passive library for wireless system-on-package (SOP) module development
IEEE transactions on microwave theory and techniques, Vol.49(10), pp.1715-1724
10/2001
Handle:
https://hdl.handle.net/2376/106097
Abstract
In this paper, we present the development and full characterization and modeling of a multilayer ceramic-based system-on-package component library. Compact high-Q three-dimensional inductor and capacitor topologies have been chosen and incorporated. A measured inductor Q factor as high as 100 and self-resonant frequency as high as 8 GHz have been demonstrated. The new vertically interdigitated capacitor topology occupies nearly an order of magnitude less of real estate while demonstrating comparable performance to the conventional topology. The low-temperature co-fired ceramic (LTCC) library has been incorporated into a 1.9-GHz CMOS power-amplifier design exhibiting a measured 17-dB gain, 26-dBm output power, and 48% power added efficiency. This power-amplifier module with fully integrated LTCC passives demonstrates a superior performance to those with full and partial on-chip passive integration.
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Details
- Title
- High-Q LTCC-based passive library for wireless system-on-package (SOP) module development
- Creators
- A Sutono - RF Solutions Inc., Atlanta, GA, USAD HeoY.-J Emery ChenJ Laskar
- Publication Details
- IEEE transactions on microwave theory and techniques, Vol.49(10), pp.1715-1724
- Academic Unit
- Electrical Engineering and Computer Science, School of
- Publisher
- IEEE
- Identifiers
- 99900546819001842
- Language
- English
- Resource Type
- Journal article