Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates

Journal article

Peer reviewed

L Meinshausen, S Bhassyvasantha, B. S Majumdar and I Dutta

Journal of electronic materials, Vol.45(1), pp.791-801

01/2016

Handle:

https://hdl.handle.net/2376/105181

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Title: Influence of Indium Addition on Whisker Mitigation in Electroplated Tin Coatings on Copper Substrates
Creators: L Meinshausen
S Bhassyvasantha
B. S Majumdar
I Dutta
Publication Details: Journal of electronic materials, Vol.45(1), pp.791-801
Academic Unit: Mechanical and Materials Engineering, School of
Identifiers: 99900546782801842
Language: English
Resource Type: Journal article