Journal article
Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications
Journal of materials science, Vol.46(21), pp.7012-7025
11/2011
Handle:
https://hdl.handle.net/2376/108707
Abstract
This study reports on the processing and characterization of composite solders produced by liquid phase sintering, which comprise a high-melting phase such as Cu embedded in a matrix of a low-melting phase such as In. These solders combine higher electrical/thermal conductivities with high mechanical compliance, and are suitable for a range of next-generation thermal interface material and interconnect applications. After considering a range of compositions, a solder with 60 volume percent In was found to possess the requisite combination of compliance and conductivity. A thin interfacial Au layer was utilized for the dual purposes of (a) enhancing the wetting between Cu and In, and (b) reducing interfacial reaction between Cu and In to form coarse intermetallic compounds (IMC) scallops, which adversely affect both mechanical and electrical/thermal properties. The Au layer increased the thermal conductivity of the solder by a factor of ~2 while reducing the yield strength to make the solder more compliant. The effects of particle size, shape, and volume fraction are discussed, and a simple model is utilized to explain the trends in the mechanical and the thermal properties.
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Details
- Title
- Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications
- Creators
- J Liu - grid.30064.31 0000000121576568 School of Mechanical and Materials Engineering Washington State University Pullman WA 99164 USAP Kumar - grid.30064.31 0000000121576568 School of Mechanical and Materials Engineering Washington State University Pullman WA 99164 USAI Dutta - grid.30064.31 0000000121576568 School of Mechanical and Materials Engineering Washington State University Pullman WA 99164 USAR Raj - grid.266190.a 0000000096214564 Department of Mechanical Engineering University of Colorado Boulder CO 80309 USAR Sidhu - grid.419318.6 0000 0004 1217 7655 Assembly Technology Development INTEL Corporation Chandler AZ 85226 USAM Renavikar - grid.419318.6 0000 0004 1217 7655 Assembly Technology Development INTEL Corporation Chandler AZ 85226 USAR Mahajan - grid.419318.6 0000 0004 1217 7655 Assembly Technology Development INTEL Corporation Chandler AZ 85226 USA
- Publication Details
- Journal of materials science, Vol.46(21), pp.7012-7025
- Academic Unit
- Mechanical and Materials Engineering, School of
- Publisher
- Springer US; New York
- Identifiers
- 99900547364401842
- Language
- English
- Resource Type
- Journal article