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Observation of twin boundary migration in copper during deformation
Journal article   Peer reviewed

Observation of twin boundary migration in copper during deformation

D.P Field, B.W True, T.M Lillo and J.E Flinn
Materials science & engineering. A, Structural materials : properties, microstructure and processing, Vol.372(1), pp.173-179
2004
Handle:
https://hdl.handle.net/2376/113198

Abstract

Twin boundaries Deformation Copper Electron backscatter diffraction (EBSD)

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