Journal article
Predicting thickness dependent twin boundary formation in sputtered Cu films
Scripta materialia, Vol.54(6), pp.999-1003
2006
Handle:
https://hdl.handle.net/2376/110052
Abstract
Triple junctions involving twin boundaries in Cu interconnects of integrated circuits have been shown to be potentially detrimental to the manufacturability of the circuit. Microstructures of annealed Cu films are dependent on film thickness and deposition parameters. This work describes texture and twin boundary development in sputtered and annealed Cu films.
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Details
- Title
- Predicting thickness dependent twin boundary formation in sputtered Cu films
- Creators
- N.-J Park - Department of Materials Science Engineering, Kumoh National Institute of Technology, Gumi, South KoreaD.P Field - School of Mechanical and Materials Engineering, Washington State University, 201 Sloan Hall, Box 642920, Pullman, WA 99164-2920, USA
- Publication Details
- Scripta materialia, Vol.54(6), pp.999-1003
- Academic Unit
- Mechanical and Materials Engineering, School of
- Publisher
- Elsevier Ltd
- Identifiers
- 99900547175901842
- Language
- English
- Resource Type
- Journal article